PLASMATHERM ICP PLASMA ETCHER
Inductively Coupled Plasma Etcher with 9.5 Inch Electrode
Etch systems are critical in manufacturing semiconductors by selectively removing layers from the wafer surface. These systems ensure precision and efficiency in the fabrication process.
Inductively Coupled Plasma Etcher with 9.5 Inch Electrode
Six Inch Nitride Etcher Automated Cassette to Cassette single wafer etching.
Reactive Ion Etch System
BatchTop VII
Other Plasma Processing Equipment and Tools
Other Plasma Processing Equipment and Tools
Plasma Resist Stripper Cassette to Cassette or Manual Operation Yield Engineering YES-CV100PZ
Other Plasma Processing Equipment and Tools
Chemical Downstream Plasma Source Applied Materials part number: 3750-0112
Combination PECVD and Dual Plasma Etch/Reactive Ion Etch Processing Systems
Like New Condition System installed in October of 2007, decommission in Feburary of 2008. Used in a R&D application The Ulvac NE 7800 is a high-temperature, high-density plasma etching system utilizing an Inductive Super Magnetron source (ICP with magnetic field). The NE 7800 is a dual load locked, cassette to cassette system designed for both R&D and production applications. Outstanding metal etching process stability for Pt/Ir/magnetic films and difficult to etch materials such as FeRAM and MRAM devices.
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